MECHANIC UV559 BGA FLUX PAST (100G)

MECHANIC FLUX  UV559 100G 

FLUX UV 559 100G  LEAD-FREE ENVIRONMENTAL PROTECTION , EASY TO TIN , NO RESIDUE , GOOD INSULATION EFFECT

DEFINITION: PLAY IN THE WELDING PROCESS: REMOVE OXIDES AND REDUCE THE SURFACE TENSION OF THE MATERIAL TO BE WELDED TWO MAIN EFFECTS PASTE CHEMICALS.

MECHANIC DEVELOPED TWO WAYS TO USE THE PHONE PCB, BGA AND PGA SMD REWORK HELP PASTE, WHICH IS USED IN LOW IONIC ACTIVATOR SYSTEM, RUN TIN SPEED, LOW LEVEL OF SMOKE RESIDUE AFTER CURING OF THE SURFACE INSULATION RESISTANCE VALUE IS VERY HIGH, SO VERY SMALL ELECTRICAL INTERFERENCE FOR MOBILE PHONES AND OTHER COMMUNICATION PRODUCTS.

PERFORMANCE:

1.UV 559AS A LEAVE-IN HELP PASTE RESIDUE COLOR IS VERY LIGHT, VERY HIGH SIR VALUE, RECOMMENDED FOR BGA, CSP BALL ARRAY SOLDER JOINT REPAIR BALL.

PACKAGE CONTENT*

1X UV 559 FLUX PASTE ( 100 GRAM )