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- Stock: Out Of Stock
- Model: MECHANIC UV559
- Weight: 150.00g
- Dimensions: 9.00cm x 7.00cm x 7.00cm
MECHANIC FLUX UV559
100G
FLUX UV 559 100G
LEAD-FREE ENVIRONMENTAL PROTECTION , EASY TO TIN , NO RESIDUE , GOOD INSULATION
EFFECT
DEFINITION: PLAY IN THE
WELDING PROCESS: REMOVE OXIDES AND REDUCE THE SURFACE TENSION OF THE MATERIAL
TO BE WELDED TWO MAIN EFFECTS PASTE CHEMICALS.
MECHANIC DEVELOPED TWO WAYS
TO USE THE PHONE PCB, BGA AND PGA SMD REWORK HELP PASTE, WHICH IS USED IN LOW
IONIC ACTIVATOR SYSTEM, RUN TIN SPEED, LOW LEVEL OF SMOKE RESIDUE AFTER CURING
OF THE SURFACE INSULATION RESISTANCE VALUE IS VERY HIGH, SO VERY SMALL
ELECTRICAL INTERFERENCE FOR MOBILE PHONES AND OTHER COMMUNICATION PRODUCTS.
PERFORMANCE:
1.UV 559AS A LEAVE-IN HELP
PASTE RESIDUE COLOR IS VERY LIGHT, VERY HIGH SIR VALUE, RECOMMENDED FOR BGA,
CSP BALL ARRAY SOLDER JOINT REPAIR BALL.
PACKAGE CONTENT*
1X UV 559 FLUX PASTE ( 100
GRAM )